Manually identifying each component on a PCB is time-consuming and error-prone. The ongoing miniaturization of components makes this process even more difficult.
Comprehensive analysisThe identification of individual components is necessary to determine manufacturing costs, CO2 footprint and other relevant properties of the PCB. This requires a detailed analysis that goes beyond mere quality control.
3D scanning of large circuit boards3D scanning large boards at high resolution requires the use of an XY stage to move the camera precisely across the board. Capturing and analyzing overlapping areas and merging them into a comprehensive bill of materials (BOM) are complex tasks that were easily solved with the EEscanner.
The EEScanner revolutionizes the analysis of electronic printed circuit boards (PCBs) through an innovative combination of 3D machine vision and artificial intelligence. This system goes far beyond conventional inspection methods and enables a comprehensive evaluation of PCBs in terms of cost, CO2 footprint and material composition.
At the heart of the EEScanner is a high-resolution light field sensor which, in conjunction with a precise XY table, enables a detailed 3D capture of the PCB surface. This technology allows large PCBs to be scanned with high accuracy, which is particularly important with the increasing miniaturization of electronic components.
The captured data is analyzed by advanced AI algorithms that are able to identify components, read optical characters (OCR), recognize logos and count pin counts. The AI models are continuously trained and improved to ensure high accuracy and reliability.
The user-friendly software of the EEScanner enables intuitive control of the scanning process and clear visualization of the results. Users can review and edit the recognized components and export bills of materials (BOM), which serve as a basis for cost and CO2 analyses.
The EEScanner thus offers an efficient solution to the challenges of modern electronics manufacturing and enables precise, automated and sustainable analyses of printed circuit boards. By reducing labour costs, speeding up production processes and optimizing the procurement of electronic components, the EEScanner contributes to increasing the competitiveness of companies in the electronics industry.
Sensor positioning with XY table
An XY stage is a precise positioning system that allows a camera or sensor to be moved exactly over the surface of a PCB. This enables the capture of images or 3D data from large PCBs that would exceed the field of view of a single fixed sensor.
Light Field Sensor HighRes
For precise measurement and analysis, high resolution in both pixels and depth is essential. Our robust and compact light field sensor reduces the demands on the XY stage, while integrated lighting creates optimal lighting conditions.
Multiview calibration
Calibration in the X and Y directions enables precise merging of partial area analyses into an overall result, while calibration in the Z direction provides accurate depth values for precise differentiation of components.
Multiview depth calculation
Our standard depth calculation provides precise data to identify individual components.
Multiview AI data curation
We label components on PCBs such as resistors, capacitors and crystals, extracting parts by part number by reading printed characters and classifying them by logos and pin count. In addition, the user can verify the result of the detection in the application immediately after the scan and correct it if necessary. The corrections are incorporated into the AI training.
Multiview AI model training
We use our multiview technology to transfer the labels from the central view to other views, providing our AI models with nine times the amount of data. AI training is done internally, which preserves data privacy. The model is trained to identify different components on a PCB and then perform other tasks such as OCR (optical character recognition), logo recognition and pin counting.
Multiview AI model
The final AI model consists of detection, classification and OCR modules. All models are optimized to run in parallel on different types of AI accelerators.
User interface
The software controls actuators and the camera to take pictures of the PCB in a grid defined by the user. The individual components (resistors, ICs, etc.) are then detected and determined. The user is shown a visualization in which each detected component is color-coded and the attributes (number of pins, type, manufacturer, etc.) are displayed. The entire scan can then be saved in a specially developed format and reloaded as required. Parts lists (BOM) can be exported from the scan, which form the basis for price or CO2 analyses.
How do I quickly and reliably evaluate electronic assemblies and PCBs? What is common practice for mechanical components in industry turns out to be a complex task for electronic components. The EE-Scanner takes over these tasks quickly and reliably and provides analyses and evaluations that give a clear advantage both in purchasing (value analyses) and in development (competitive analyses).
By automating the process, manual labor costs are reduced. The checking and correction of scan results can be carried out flexibly at other locations, which means that skilled workers can be deployed more efficiently. Only one assistant is required on site for set-up and scanning, while skilled workers can support multiple locations remotely.
The consistent use of the EEScanner in the procurement of electronic assemblies raises the savings potential in the supply chain.
The AI-supported analysis of the EEScanner enables precise and reliable identification of components. Multiview technology and high-resolution 3D measurement ensure detailed and accurate detection of PCBs. This minimizes human error and improves the overall quality of the inspection results.
The EEScanner can handle different PCB sizes and complexities. The software allows flexible control and customization of scan parameters. The ability to check and correct the scan results provides additional flexibility in the work process.
The EEScanner not only enables component identification, but also the calculation of manufacturing costs, CO2 footprint and other relevant properties. The exportable parts lists (BOM) form the basis for detailed analyses and reports. This supports comprehensive quality control and enables well-founded decisions to be made in production.
